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It is possible to observe cross-sections while observing FIB processing in real time.
A new method for structural analysis of electronics products manufactured with nanoscale precision, such as semiconductor devices, MEMS, and TFTs: We propose cross-beam FIB for cross-sectional observation.
![[Data] Cross-sectional observation of solar cell modules](https://image.www.ipros.com/public/product/image/cc1/2000561879/IPROS02201267418243097889.png?w=280&h=280)
We have published cross-sectional observations of the fracture surface and elemental maps of the fracture area!
This document introduces the cross-sectional observation of solar cell modules. After inspecting the solar cell module that underwent thermal shock testing, cross-sectional observations were conducted at the identified areas of abnormality, confirming that the interconnector solder joint had fractured. 【Contents】 ■ Cross-sectional observation of the fracture ■ Elemental map of the fracture *For more details, please refer to the PDF document or feel free to contact us.
